Thursday, July 25, 2019
Bill of Material Essay Example | Topics and Well Written Essays - 250 words
Bill of Material - Essay Example and SAP Inc. designs the BOM for many enterprises depending on the nature and ERP needs of the enterprise in question. The technology companies have to make the BOM application user-friendly so that the management may find ease and efficiency when using it. BOM is a merely a list of the components required to build a product by detailing and providing the manufacturers part number and the amount of quantity need for a particular component. For example, Microsoft deals with production of computer hardware, which typically consists of different parts. The company, therefore, uses the BOM track the components needed to complete a single computer hardware. That enables the company to track the production cost per unit head. Similarly, SAP is a computer technology and hardware company that assembles computer hardware parts to supply to their clients. Consequently, SAP uses the BOM track the cost of particular parts needed for completion of a single product design. Additionally, SAP management can use the information generated to manage its stock and plan for deliveries from suppliers in time. The policies concerning stock control effectiveness is easily monitored through BOM In general, BOM benefits Microsoft Dynamics and Systems, Applications and Products (SAP) in many ways. Some of the benefits include; facilitating and the location of items. Hence, it saves time spent. Additionally, the software identifies the changes that materials have undergone with respect to a particular time. The rules that govern the use materials can be useful using BOM. Lastly, BOM software, gives reports of the full audit of the material usage, all the approvals made during requisition of materials and all the costing involved (Hua & He, 2010). He, P., & Xu, X. (2009). Improving process flexibility through products assignment with bill of material constraints.Ã Robotics And Computer-Integrated Manufacturing,Ã 25(3), 582-588.
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